Associate Process Technician -Wirebond Tech

Job Summary

Process Assembly Technician for the wire bonding of focal plane arrays. This includes, but is not limited to, piece part handling, chemical handling, device inspection (optical microscope), and device assembly.

Job Responsibilities

•    Execute instructions for wire bonding semiconductor devices in a variety of configurations as well as demounting devices for further processing.
•    Inspect completed devices and map out defects. Troubleshoot and rework devices as needed.
•    Maintain and record observed process deviations
•    Work with process engineer to ensure accuracy of work instructions. 
•    All other related duties as assigned.

Qualifications

•    High School diploma is required.    
•    5 or more years of equivalent technical experience in wire-bonding, semiconductor device processing and testing, or semiconductor material handling. Direct experience in wire-bonding desired.
•    Ability to work with minimal direct supervision. 
•    Capable of working in a clean room environment. Work experience in a Class 100 clean room is recommended.
•    Good manual dexterity.
•    Good communication skills both written and verbal. 
•    Attention to detail and excellent data collection, documentation and reporting skills.
•    Balance throughput requirements between different product areas with coordination between engineering and operations personnel including technicians, operators, planning, and other product areas.
•    Must be able to work autonomously as well as in a team environment

•    Working knowledge with computer skills such as Microsoft Excel, Word, and floor control or manufacturing execution systems (MES).

Desired Skills

• Experience in wirebonding of semiconductor devices.
• Familiarity with automated and manual wirebonders. Ability to work with capillary setup and simple wirebonder maintenance a strong plus.
• Familiarity with wafer/piece part processing including manual handling of individual devices.
• Clean-room experience with photolithography and vacuum tools, optical microscopes, Nanospec, etc. is a plus.

Working Conditions

•    Primarily non-cleanroom area
•    Secondary class 100 Semiconductor Cleanroom